Resin bond diamond grinding wheel aluminum base material

Resin Bond Diamond Grinding Wheel
June 24, 2025
Category Connection: Resin Bond Grinding Wheel
Brief: Discover the high-performance 1A1 75*6*32*19.05*10mm D100/120 Resin Bond Diamond Grinding Wheel, designed for precision grinding of hard materials like ceramics, glass, and cemented carbide. Learn about its features, applications, and customization options.
Related Product Features:
  • High grinding efficiency with diamond abrasive for quick material removal.
  • Good self-sharpening due to resin binder wear, maintaining sharpness.
  • Low grinding temperature reduces thermal damage to workpieces.
  • High surface quality for precision machining with minimal chipping.
  • Lightweight design suitable for high-speed grinding operations.
  • Customizable sizes and specifications to meet specific needs.
  • Ideal for cemented carbide, ceramics, glass, and semiconductor materials.
  • Secure packaging ensures safe delivery and prevents damage.
Faqs:
  • What materials can the resin bond diamond grinding wheel process?
    It is suitable for hard and brittle materials like ceramics, glass, semiconductors, and cemented carbide.
  • Can the grinding wheel be customized to specific sizes?
    Yes, we can customize dimensions, abrasive types, and concentrations based on your requirements.
  • How is the grinding wheel packaged for shipping?
    Each wheel is packed in a sealed bag with bubble film, placed in a carton, and shipped via reliable couriers with tracking provided.