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Resin Bond Diamond Grinding Wheel 4A2 150*14*20*5*2mm D64 C100 for Sharpening of carbide tools

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October 13, 2025
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Brief: Discover the high-performance Resin Bond Diamond Grinding Wheel 4A2, designed for sharpening carbide tools with precision. This 150*14*20*5*2mm D64 C100 wheel offers high grinding efficiency, excellent self-sharpening, and superior surface quality for hard and brittle materials like ceramics, glass, and semiconductors.
Related Product Features:
  • High grinding efficiency with ultra-hard diamond abrasives (Mohs hardness 10) for quick material removal.
  • Good self-sharpening due to resin binder wear, maintaining continuous sharpness.
  • Low grinding temperature reduces thermal damage, ideal for precision work.
  • High surface quality minimizes chipping or cracks on workpieces.
  • Lightweight design suitable for high-speed grinding applications.
  • Customizable sizes available to meet specific grinding needs.
  • Versatile applications for cemented carbide, ceramics, glass, and semiconductor materials.
  • Competitive pricing with reliable packaging and global shipping options.
Faqs:
  • What materials can the Resin Bond Diamond Grinding Wheel process?
    It is suitable for hard and brittle materials like cemented carbide, ceramics, glass, semiconductors, and stone.
  • Can the grinding wheel be customized to different sizes?
    Yes, we offer customizable sizes to meet specific grinding requirements.
  • What are the advantages of using a resin bond diamond grinding wheel?
    It provides high grinding efficiency, excellent self-sharpening, low grinding temperature, and superior surface quality for precision work.
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