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12V9 150*20*31.75*10mm D30 C125 Resin bond diamond wheel

Resin Bond Diamond Grinding Wheel
April 18, 2025
Category Connection: Resin Bond Grinding Wheel
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Tags:
#resinoid grinding wheels #carbide sharpening wheel #resin bond diamond wheels
Brief: Discover the 12V9 150*20*31.75*10mm D30 C125 Resin Bond Diamond Grinding Wheel, designed for precision grinding of carbide tools, ceramic components, and semiconductor materials. This high-quality grinding wheel features diamond abrasives for ultra-hardness and wear resistance, with a resin binder for elasticity and heat dissipation. Perfect for tool grinders and cylindrical grinders.
Related Product Features:
  • 12V9 cup wheel shape for precision grinding applications.
  • 150mm outer diameter (D) and 20mm thickness (T) for versatile use.
  • 31.75mm inner hole diameter (H) ensures compatibility with standard machines.
  • 10mm abrasive width (W) for precise material removal.
  • D30 diamond abrasive grit (G) provides ultra-high hardness and wear resistance.
  • C125 diamond concentration (C) for optimal performance.
  • Resin binder (phenolic, polyimide, or epoxy) offers elasticity and heat dissipation.
  • Customizable sizes available to meet specific requirements.
Faqs:
  • What materials can the 12V9 Resin Bond Diamond Grinding Wheel process?
    This grinding wheel is ideal for processing carbide tools, ceramic components, and semiconductor materials.
  • What machine tools are compatible with this grinding wheel?
    It is suitable for use with tool grinders and cylindrical grinders.
  • Can the grinding wheel be customized to different sizes?
    Yes, we offer customization for other sizes based on your specific requirements.
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