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1A1 75*6*32*19.05*10mm D100/120 Resin Bond Diamond Grinding Wheel

1A1 75*6*32*19.05*10mm D100/120 Resin Bond Diamond Grinding Wheel

Product Details:
Place of Origin: Henan, China
Brand Name: JC
Certification: ISO
Model Number: 1A1
Payment & Shipping Terms:
Minimum Order Quantity: 5 pieces
Price: Negotiable
Packaging Details: 1 pcs in one Paper Box
Delivery Time: 5-8 work days
Payment Terms: T/T, D/A, D/P, Western Union,Paypal
Supply Ability: 10,000 /month
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Detailed Product Description
Shape: Circular Usage: Grinding
Bond Agent: Resin Delivery: By Express
Package: Carton Box HS Code: 6804211000
Abrasives: Diamond Application: Machining High Speed Steel
Diameter: 75mm Thickness: 6mm
Inner Hole: 19.05mm Abrasive Width: 10mm
Granularity: D100/120
Highlight:

Resin Bond Diamond Grinding Wheel

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D100 Resin Bond Diamond Grinding Wheel

1A1 Resin Bond Doamond Grinding Wheel Product Description


Product Name: Resin Bond Diamond Grinding Wheel


Product Overview:

 

Resin diamond grinding wheel is a high-performance grinding tool with resin as the binder and diamond abrasive as the cutting body. It combines the ultra-high hardness of diamond and the flexibility of resin binder, and is suitable for high-precision and high-efficiency processing of hard and brittle materials such as ceramics, glass, semiconductors, and cemented carbide.

 

Product Features:

 

High grinding efficiency: Diamond has an extremely high hardness (Mohs hardness 10), which can quickly remove hard and brittle materials.

Good self-sharpening: Resin binders wear moderately, which can continuously expose new abrasive grains and maintain sharpness.

Low grinding temperature: Resin has poor thermal conductivity, but thermal damage can be reduced through pores or coolant.

High surface quality: Suitable for precision machining, reducing chipping or cracks on the workpiece.

Lightweight design: Resin has low density and is suitable for high-speed grinding.

 

Product size(mm):

 

Diameter(D) Thickness(T) Inner hole(H) Abrasive width(W) Granularity
75 6 19.05 10 D100/120

 

Of course if you need other sizes , we can  customize for you.

 

Application:

 

Cemented carbide: sharpening and polishing of cutting tools and molds.

Ceramics/glass: precision processing of mobile phone covers and optical lenses.

Semiconductor materials: cutting and grinding of silicon wafers and silicon carbide wafers.

Stone processing: shaping and polishing of marble and granite.

 

Packaging and Shipping:

 

Each CBN grinding wheel is carefully packed in a sealed bag and wrapped with bubble film to prevent scratches or damage during transportation. After packaging, it is placed in a carton and sealed securely with tape. All orders are shipped via reliable couriers. After the order is shipped, we will provide customers with tracking information and estimated delivery time.

 

If you need to customize, please provide the following information:

 

1. Dimensions, including outer diameter, aperture, thickness, width and thickness of abrasive layer;

2. Abrasive, abrasive sand particle and concentration;

3. Wheel application;

4. Pictures and drawings of wheels;

We can then design and quote for you

Contact Details
ZHENGZHOU JINCHUAN ABRASIVES CO., LTD.

Contact Person: Dora

Tel: +8617797761592

Send your inquiry directly to us
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