1V1 45 Degrees Resin Diamond Grinding Wheel D120
1V1 resin bond plain wheel is mainly used for surface grinding ,cylindrical grinding of hand carbide measuring tools ,cutting tools,moulds and also for plunge-cut grinding as well as for grinding.
Resin bonded diamond grinding wheel are mainly apllied in the machining for tungsten carbide, ceramic materials, magnetic materials, silicon materials, thermal spraying alloy materials and so on.
Size | Diameter | Thickness | Inner hole | Grit Size |
125mm | 12.7mm | 31.75mm |
D120 C100
|
Advantages
light weight ,easy to take
Excellent surface roughness and flatness
High processing speed working fast
Low temperature curing of grinding wheel, short production cycle, convenient, quick and simple equipment and supply process
Applications
Mainly used for grinding high-hard alloys, non-metallic materials, cutting hard and brittle hard alloys, non-metallic minerals, etc. Such as cemented carbide, ceramics, agate, optical glass, semiconductor materials and wear-resistant cast iron, stone, etc.Specially used to all kinds of sbrssives machine
If you need to customize, please provide the following information:
1. Dimensions, including outer diameter, aperture, thickness, width and thickness of abrasive layer;
2. Abrasive, abrasive sand particle and concentration;
3. Adhesive;
4. Wheel application;
5. Pictures and drawings of wheels;
We can then design and quote for you