1A1R diamand saw blade
For diamond saw blade, the working layer of the grinding wheel contains diamond abrasive grains, and the diamond abrasives are bonded to the substrate by a metal bond. First, the thickness of the metal bond deposited is 20% of the height of the diamond abrasive grains (sanding), and then the metal bond is used to bond (thicken) the diamond abrasive grains, and the thickness is about 2/3 of the height of the abrasive grains.
1. It is easy to use without trimming;
2. The single-layer structure determines that it can achieve a high working speed, which is currently as high as 250-300m/s abroad;
3. Although there is only a single-layer diamond, it still has sufficient life;
4. High precision requirements for roller grinding wheels, electroplating manufacturing methods.