125*1.6*32*1.2 Diamond Saw Blade,
1A1R Diamond Saw Blade,
1A1R diamond cutting blade
1A1R diamand saw blade
For diamond saw blade, the working layer of the grinding wheel contains diamond abrasive grains, and the diamond abrasives are bonded to the substrate by a metal bond. First, the thickness of the metal bond deposited is 20% of the height of the diamond abrasive grains (sanding), and then the metal bond is used to bond (thicken) the diamond abrasive grains, and the thickness is about 2/3 of the height of the abrasive grains.
1. It is easy to use without trimming;
2. The single-layer structure determines that it can achieve a high working speed, which is currently as high as 250-300m/s abroad;
3. Although there is only a single-layer diamond, it still has sufficient life;
4. High precision requirements for roller grinding wheels, electroplating manufacturing methods.